Layer: 1-40 layers
PCB Types:
High-Level, High Frequency, Blind and buried vias, HDI, Impedance Controlled Board, Laser Drilling, Heavy Gold and Heavy Copper PCBs and etc.
Board Materials:
Normal Materials: SHENGYI, ITEQ, KB
Special Materials: ROGERS, ARLON, TACONIC, NELCO, ISOLA, Halogen Free
High TG: S1000-2, S1170, IT180
Materials: FR-4 TG-140, FR-4 TG-170, CEM-1, CEM-3
Finished Surfaces:
OSP(Entek), HASL, HASL LF, ENIG (Immersion Gold), Immersion Silver, Immersion Tin, Flash Gold, Hard Gold, Golden Finger, ENEPIG
Tolerance:
Thickness ≤ 1.0 mm: +/-0.1 mm
1.0 mm < Thickness ≤ 2.0 mm: +/-10%
Thickness > 2.0 mm: +/-8%
PTH: +/-3 mil, NPTH: +/-2 mil
Outline Tolerance:
Length: ≤ 100 mm: +/-0.1 mm
100 < Length ≤ 300 mm: +/-0.15 mm
Length > 300 mm: +/-0.2 mm
Technical Specification:
Min Line Width/Gap: 3/3 mil
Min hole size: 0.15 mm for mechanical drill 0.1 mm for laser drill
Min Annular Ring: 4 mil
Max Copper Thickness: 12 oz
Max Finished Size: ≤2 layers 600*1200 mm
Multi-layers 500*1200 mm
Board Thickness: 2 Layer 0.2-7 mm
Multi-layers: 0.4-7 mm
Min Soldermask Bridge: ≥ 0.8 mm
Aspect Ration: 15:1
Plugging Vias Capability: 0.2-0.8 mm
Gold:
Au, Ni Thickness Control:
1. ENIG: Au 1-10u”
2. Gold Finger: Au 1-150u”
3. Platting Gold: Au 1-3u
4. Hard gold: Au 1-150u”
5. Ni thickness: 50-500u”
6. Ni-Pd-Au: Pd 2-5u”, Au 1-8u”